Invention Grant
- Patent Title: Radiation hardened high voltage superjunction MOSFET
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Application No.: US17804491Application Date: 2022-05-27
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Publication No.: US11757001B2Publication Date: 2023-09-12
- Inventor: Kiraneswar Muthuseenu , Samuel Anderson , Takeshi Ishiguro
- Applicant: IceMos Technology Limited
- Applicant Address: GB Belfast
- Assignee: IceMos Technology Limited
- Current Assignee: IceMos Technology Limited
- Current Assignee Address: GB Belfast
- Agency: PATENT LAW GROUP: Atkins and Associates, P.C.
- Agent Robert D. Atkins
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/06 ; H01L29/423 ; H01L29/78 ; H01L29/66 ; H01L29/10 ; H01L21/265

Abstract:
A high voltage superjunction MOSFET includes a semiconductor substrate and a semiconductor layer having columns of first and second conductivity. A buffer layer of the first conductivity is between the semiconductor substrate and semiconductor layer. A plug region of the second conductivity is formed at a semiconductor layer surface and extends to the columns. A source/drain region is formed at the semiconductor layer surface and is connected to the plug region. The source/drain region has a concentration of the first conductivity between about 1×1019 cm−3 and 1.5×1020 cm−3. A body region of the second conductivity is between the source/drain region and the first column and is connected to the plug region. A gate trench is formed in the semiconductor layer surface and extends toward the first column and has a trench gate electrode disposed therein. A dielectric layer separates the trench gate electrode from the first column.
Public/Granted literature
- US20220293733A1 Radiation Hardened High Voltage Superjunction MOSFET Public/Granted day:2022-09-15
Information query
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