Invention Grant
- Patent Title: High voltage device
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Application No.: US17731159Application Date: 2022-04-27
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Publication No.: US11757034B2Publication Date: 2023-09-12
- Inventor: Hung-Sen Wang , Yun-Ta Tsai , Ruey-Hsin Liu , Shih-Fen Huang , Ho-Chun Liou
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- The original application number of the division: US16906894 2020.06.19
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/06 ; H01L29/06 ; H01L29/66 ; H01L29/423

Abstract:
A high-voltage device includes a first frame-like isolation and a second frame-like isolation separated from each other, a first frame-like gate structure covering the first frame-like isolation, a second frame-like gate structure covering the second frame-like isolation, a first drain region enclosed by the first frame-like isolation, a second drain region enclosed by the second frame-like isolation, a first frame-like source region surrounding the first frame-like gate structure, a second frame-like source region surrounding the second frame-like gate structure, a first doped region surrounding the first and second frame-like gate structures, and a second doped region disposed between the first and second frame-like gate structures. The first and second drain regions, and the first and second frame-like source regions include a first conductivity type. The first and the second doped region include a second conductivity type. The first conductivity type and the second conductivity type are complementary to each other.
Public/Granted literature
- US20220254923A1 HIGH VOLTAGE DEVICE Public/Granted day:2022-08-11
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