Invention Grant
- Patent Title: LDMOS transistor and method for manufacturing the same
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Application No.: US17735899Application Date: 2022-05-03
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Publication No.: US11757035B2Publication Date: 2023-09-12
- Inventor: Bing Wu , Chien Ling Chan , Liang Tong
- Applicant: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
- Applicant Address: CN Hangzhou
- Assignee: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
- Current Assignee: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Hangzhou
- Agency: Alston & Bird LLP
- Priority: CN 1810055437.3 2018.01.19
- The original application number of the division: US16247007 2019.01.14
- Main IPC: H01L21/308
- IPC: H01L21/308 ; H01L29/78 ; H01L29/66 ; H01L29/10 ; H01L29/40 ; H01L29/08 ; H01L21/265 ; H01L21/3213 ; H01L29/417 ; H01L29/06 ; H01L21/266

Abstract:
An LDMOS transistor and a method for manufacturing the same are provided. The method includes: forming an epitaxial layer on a substrate, forming a gate structure on an upper surface of the epitaxial layer, forming a body region and a drift region in the epitaxial layer, forming a source region in the body region, forming a first insulating layer on the gate structure and an upper surface of the epitaxial layer and, forming a shield conductor layer on the first insulating layer, forming a second insulating layer covering the shield conductor layer, forming a first conductive path, to connect the source region with the substrate, and forming a drain region in the drift region. By forming the first conductive path which connects the source region with the substrate, the size of the LDMOS transistor and the resistance can be reduced.
Public/Granted literature
- US20220262947A1 LDMOS TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-08-18
Information query
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