Invention Grant
- Patent Title: Photosensitive sensor, manufacturing method thereof, and display panel
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Application No.: US17040989Application Date: 2020-03-24
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Publication No.: US11757059B2Publication Date: 2023-09-12
- Inventor: Shengguang Ban
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Ling and Yang Intellectual Property
- Agent Ling Wu; Stephen Yang
- Priority: CN 1910440732.5 2019.05.24
- International Application: PCT/CN2020/080946 2020.03.24
- International Announcement: WO2020/238366A 2020.12.03
- Date entered country: 2020-09-24
- Main IPC: H01L31/105
- IPC: H01L31/105 ; H01L31/101 ; H01L31/20 ; G06V40/13

Abstract:
A photosensitive sensor, a manufacturing method thereof and a display panel are provided. The photosensitive sensor includes a first type semiconductor layer, an intrinsic semiconductor layer disposed on a side of the first type semiconductor layer, and a second type semiconductor layer disposed on a side of the intrinsic semiconductor layer away from the first type semiconductor layer. The intrinsic semiconductor layer is provided with metal particles capable of generating a surface plasmon effect. The metal particles are dispersely distributed in the intrinsic semiconductor layer.
Public/Granted literature
- US20220384670A1 Photosensitive Sensor, Manufacturing Method Thereof, and Display Panel Public/Granted day:2022-12-01
Information query
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