Invention Grant
- Patent Title: Semi-solid electrodes with a polymer additive
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Application No.: US17173420Application Date: 2021-02-11
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Publication No.: US11757129B2Publication Date: 2023-09-12
- Inventor: Taison Tan , Naoki Ota , Jeffry Disko
- Applicant: 24M Technologies, Inc.
- Applicant Address: US MA Cambridge
- Assignee: 24M Technologies, Inc.
- Current Assignee: 24M Technologies, Inc.
- Current Assignee Address: US MA Cambridge
- Agency: Cooley LLP
- Main IPC: H01M10/0565
- IPC: H01M10/0565 ; H01M4/64 ; H01M10/058 ; H01M4/13 ; H01M4/62 ; H01M10/052

Abstract:
Embodiments described herein relate generally to electrochemical cells having semi-solid electrodes that include a gel polymer additive such that the electrodes demonstrate longer cycle life while significantly retaining the electronic performance of the electrodes and the electrochemical cells formed therefrom. In some embodiments, a semi-solid electrode can include about 20% to about 75% by volume of an active material, about 0.5% to about 25% by volume of a conductive material, and about 20% to about 70% by volume of an electrolyte. The electrolyte further includes about 0.01% to about 1.5% by weight of a polymer additive. In some embodiments, the electrolyte can include about 0.1% to about 0.7% of the polymer additive.
Public/Granted literature
- US20210376380A1 SEMI-SOLID ELECTRODES WITH GEL POLYMER ADDITIVE Public/Granted day:2021-12-02
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