Invention Grant
- Patent Title: Semiconductor device and package
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Application No.: US17468561Application Date: 2021-09-07
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Publication No.: US11757170B2Publication Date: 2023-09-12
- Inventor: Gareth Pryce Weale , Joseph Steffler
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Scottsdale
- Agent Robert F. Hightower
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01Q1/22 ; H01L21/768 ; H01L23/482
Abstract:
In an embodiment, an antenna may be formed by applying an insulator to a package body and forming at least a portion of the antenna as a conductor on the insulator.
Public/Granted literature
- US20210408666A1 METHOD OF FORMING A SEMICONDUCTOR DEVICE Public/Granted day:2021-12-30
Information query
IPC分类:
