Invention Grant
- Patent Title: Liquid cooled current sensor assemblies
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Application No.: US17212199Application Date: 2021-03-25
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Publication No.: US11757349B2Publication Date: 2023-09-12
- Inventor: Fan Wang , Serdar Hakki Yonak , Yantao Song , Miao Wang
- Applicant: FORD GLOBAL TECHNOLOGIES, LLC
- Applicant Address: US MI Dearborn
- Assignee: FORD GLOBAL TECHNOLOGIES, LLC
- Current Assignee: FORD GLOBAL TECHNOLOGIES, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Carlson, Gaskey & Olds, P.C.
- Agent David B. Kelley
- Main IPC: H02M1/32
- IPC: H02M1/32 ; H05K7/20 ; H02K11/33 ; H05K7/14 ; H02M7/00

Abstract:
This disclosure is directed to power systems for transferring power between electrical components. An exemplary power system includes a first electrical component (e.g., an inverter system) having a current sensor assembly for detecting current flowing between the first electrical component and a second electrical component (e.g., an electric motor) in order to more reliably manage and control operation of the second electrical component. The current sensor assembly may include an integrated cooler that includes an internal cooling circuit configured to circulate coolant for cooling one or more bus bars of the current sensor assembly.
Public/Granted literature
- US20220311325A1 LIQUID COOLED CURRENT SENSOR ASSEMBLIES Public/Granted day:2022-09-29
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