Invention Grant
- Patent Title: Radio frequency module and communication device
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Application No.: US18157265Application Date: 2023-01-20
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Publication No.: US11757476B2Publication Date: 2023-09-12
- Inventor: Masakazu Hirobe , Takanori Uejima , Yoshihiro Daimon , Nanami Yumura
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 20136565 2020.08.13
- Main IPC: H04B1/00
- IPC: H04B1/00 ; H04B1/16

Abstract:
A radio frequency module includes a transmit filter that allows a transmit signal of a band A for FDD to pass through, a receive filter that allows a receive signal of the band A to pass through, a filter that allows a transmit/receive signal of a band B for TDD to pass through, power amplifiers, a low noise amplifier, a switch between connecting the receive filter to the low noise amplifier and connecting the filter to the low noise amplifier, a switch between connecting the filter to the power amplifier and connecting the filter to the low noise amplifier, a matching circuit connected between the power amplifier and the transmit filter, a matching circuit connected between the power amplifier and the switch, and a module board. On the module board, each of the power amplifiers and the switch is arranged in between the matching circuit and the matching circuit.
Public/Granted literature
- US20230155611A1 RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2023-05-18
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