Invention Grant
- Patent Title: Electronic device
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Application No.: US17587098Application Date: 2022-01-28
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Publication No.: US11758313B2Publication Date: 2023-09-12
- Inventor: Ching-Ming Hung , Sheng-Hsiung Tsai , Pei-Shuang Huang
- Applicant: Chiun Mai Communication Systems, Inc.
- Applicant Address: TW New Taipei
- Assignee: Chiun Mai Communication Systems, Inc.
- Current Assignee: Chiun Mai Communication Systems, Inc.
- Current Assignee Address: TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN 2110162187.5 2021.02.05
- Main IPC: H04R1/08
- IPC: H04R1/08

Abstract:
An electronic device includes a circuit board, a protective assembly, and a protective film. The protective assembly providing a cavity is arranged on one side of the circuit board. The protective assembly includes a first protective unit and a second protective unit. A third through hole communicating with the cavity is defined in the first protective unit. A supporting surface is defined on the second protective unit facing the third through hole. A projection of the third through hole is overlapped with a projection of the supporting surface along the first direction. The protective film is coupled to the protective assembly and arranged in the cavity to divide the cavity into a first cavity and a second cavity. The above-mentioned electronic device resists deformation of the protective film by setting the second protective unit between the circuit board and the protective film.
Public/Granted literature
- US20220256268A1 ELECTRONIC DEVICE Public/Granted day:2022-08-11
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