Invention Grant
- Patent Title: Processor module retention
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Application No.: US17375522Application Date: 2021-07-14
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Publication No.: US11758664B2Publication Date: 2023-09-12
- Inventor: Jason R. Eagle , Scott R. LaPree
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Grant M. McNeilly
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/18 ; H05K3/30 ; H05K1/02

Abstract:
An apparatus includes a motherboard with a processor socket, a load frame connected to the motherboard adjacent to at least two sides of the processor socket, and a processor retainer rotatably connected to the load frame, the processor retainer being positionable in a closed position, an opened position, and an installation position. The processor retainer extends over the processor socket when the processor retainer is in the closed position.
Public/Granted literature
- US20230018261A1 PROCESSOR MODULE RETENTION Public/Granted day:2023-01-19
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