Invention Grant
- Patent Title: Heat dissipation module
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Application No.: US17195691Application Date: 2021-03-09
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Publication No.: US11758692B2Publication Date: 2023-09-12
- Inventor: Chien-An Chen , Chien-Yu Chen , Wei-Hao Chen , Bo-Zhang Chen , Chun-Chi Lai , Yun-Kuei Lin
- Applicant: AURAS TECHNOLOGY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: AURAS TECHNOLOGY CO., LTD.
- Current Assignee: AURAS TECHNOLOGY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: AMIN, TUROCY & WATSON. LLP
- Priority: TW 9143249 2020.12.08
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D21/00 ; F28F3/00

Abstract:
A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.
Public/Granted literature
- US20210392786A1 HEAT DISSIPATION MODULE Public/Granted day:2021-12-16
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