Invention Grant
- Patent Title: Array substrate, fabricating method therefor and display panel
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Application No.: US17259729Application Date: 2020-03-18
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Publication No.: US11758786B2Publication Date: 2023-09-12
- Inventor: Li Liu , Pengcheng Lu , Rongrong Shi , Yuanlan Tian , Junbo Wei , Dacheng Zhang
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg
- International Application: PCT/CN2020/079876 2020.03.18
- International Announcement: WO2021/184235A 2021.09.23
- Date entered country: 2021-01-12
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L51/56 ; H10K59/35 ; H10K50/818 ; H10K50/852 ; H10K50/856 ; H10K59/123 ; H10K71/00 ; H10K102/10

Abstract:
The present disclosure provides an array substrate including a driving circuit board, and a first electrode layer, an insulating layer, and an anode structure sequentially stacked thereon. The anode structure includes a reflective layer, an intermediate dielectric layer, and a transparent conductive layer sequentially provided in a direction away from the driving circuit board. The array substrate has first, second, and third pixel regions. The anode structure includes first, second, and third anode structures. The first electrode layer includes first, second and third sub-portions. The first, second and third anode structures are coupled with the first, second and third sub-portions through first, second and third via holes in the insulating layer, respectively. A surface of the insulating layer in contact with the first, second and third anode structures is flush; and a thickness of the intermediate dielectric layer in the second, first and third anode structures increases sequentially.
Public/Granted literature
- US20220140018A1 ARRAY SUBSTRATE, FABRICATING METHOD THEREFOR AND DISPLAY PANEL Public/Granted day:2022-05-05
Information query
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