Invention Grant
- Patent Title: Method of manufacturing magnetoresistive random access memory device
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Application No.: US17567211Application Date: 2022-01-03
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Publication No.: US11758825B2Publication Date: 2023-09-12
- Inventor: Baeseong Kwon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR 20190080642 2019.07.04
- The original application number of the division: US16819506 2020.03.16
- Main IPC: H10N50/80
- IPC: H10N50/80 ; H01L23/522 ; H10B61/00 ; H10N50/01

Abstract:
A magnetoresistive random access memory (MRAM) device and a method of manufacturing the same, the device including a substrate; a memory unit including a lower electrode, a magnetic tunnel junction (MTJ) structure, and an upper electrode sequentially stacked on the substrate; a passivation pattern on a sidewall of the memory unit; a via on the memory unit and contacting the upper electrode; and a wiring on the via and contacting the via, wherein a center portion of the upper electrode protrudes from a remaining portion of the upper electrode in a vertical direction substantially perpendicular to an upper surface of the substrate.
Public/Granted literature
- US20220123202A1 METHOD OF MANUFACTURING MAGNETORESISTIVE RANDOM ACCESS MEMORY DEVICE Public/Granted day:2022-04-21
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