Invention Grant
- Patent Title: Memory device structure with protective element
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Application No.: US17324328Application Date: 2021-05-19
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Publication No.: US11758830B2Publication Date: 2023-09-12
- Inventor: Hai-Dang Trinh , Hsing-Lien Lin , Cheng-Yuan Tsai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- The original application number of the division: US15821901 2017.11.24
- Main IPC: H10N70/00
- IPC: H10N70/00 ; H10N70/20

Abstract:
A semiconductor device structure is provided. The structure includes a semiconductor substrate and a data storage element over the semiconductor substrate. The structure also includes an ion diffusion barrier element over the data storage element and a protective element extending along a sidewall of the ion diffusion barrier element. A bottom surface of the protective element is between a top surface of the data storage element and a bottom surface of the data storage element. The structure further includes a first electrode electrically connected to the data storage element and a second electrode electrically connected to the data storage element.
Public/Granted literature
- US20210273161A1 MEMORY DEVICE STRUCTURE Public/Granted day:2021-09-02
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