Invention Grant
- Patent Title: Haptic information provision device
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Application No.: US17901176Application Date: 2022-09-01
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Publication No.: US11760375B2Publication Date: 2023-09-19
- Inventor: Seoung Hun Do , Hyeong Jun Kim
- Applicant: CK MATERIALS LAB CO., LTD.
- Applicant Address: KR Seoul
- Assignee: CK MATERIALS LAB CO., LTD.
- Current Assignee: CK MATERIALS LAB CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: NKL Law
- Agent Jae Youn Kim
- Priority: KR 20150006450 2015.01.13 KR 20150068717 2015.05.18 KR 20150071970 2015.05.22
- The original application number of the division: US15543330
- Main IPC: B60W50/16
- IPC: B60W50/16 ; A44C5/00 ; B60W30/12 ; G01C21/26 ; G01C21/36 ; G06F1/16 ; G06F3/01 ; G08B6/00 ; G08G1/16 ; H04M19/04 ; H01F1/44

Abstract:
The present invention relates to a haptic information provision device. The haptic information provision device (100) according to the present invention comprises: a receiver (120) for receiving external notification information; a controller (130) for converting the notification information to a haptic signal; and an operation unit (110) for transferring haptic information to a user according to the haptic signal, wherein the operation unit (110) includes a plurality of operation units (110a-110j), the respective operation units (110a-110j) operating in response to different notification information and thus transferring different haptic information to the user.
Public/Granted literature
- US20230001949A1 HAPTIC INFORMATION PROVISION DEVICE Public/Granted day:2023-01-05
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