Invention Grant
- Patent Title: Polyimide resin precursor
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Application No.: US16863477Application Date: 2020-04-30
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Publication No.: US11760838B2Publication Date: 2023-09-19
- Inventor: Hiroyuki Matsuyama , Yoshinori Sato
- Applicant: Arisawa Mfg. Co., Ltd.
- Applicant Address: JP Joetsu
- Assignee: Arisawa Mfg. Co., Ltd.
- Current Assignee: Arisawa Mfg. Co., Ltd.
- Current Assignee Address: JP Niigata
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP 16013779 2016.01.27
- Main IPC: C08G73/10
- IPC: C08G73/10 ; B32B15/08 ; B32B27/28 ; H05K1/03 ; B32B15/20

Abstract:
The polyimide resin precursor in the present embodiment is a polyimide resin precursor obtained by allowing a diamine component and a tetracarboxylic acid anhydride component to react with each other, wherein based on the whole of the diamine component, the content of p-phenylenediamine is 75 mol % or more; the tetracarboxylic acid anhydride component includes an ester-containing tetracarboxylic acid anhydride represented by formula (1), and at least one biphenyltetracarboxylic acid anhydride selected from the group consisting of 3,4,3′,4′-biphenyltetracarboxylic acid dianhydride, 2,3,3′,4′-biphenyltetracarboxylic acid dianhydride and 2,3,2′,3′-biphenyltetracarboxylic acid dianhydride; and based on the whole of the tetracarboxylic acid anhydride component, (i) the total of the content of the ester-containing tetracarboxylic acid anhydride and the content of the biphenyltetracarboxylic acid anhydride is 75 mol % or more, and (ii) the content of the ester-containing tetracarboxylic acid anhydride is 15 to 80 mol %, and the content of the biphenyltetracarboxylic acid anhydride is 85 to 20 mol %.
Public/Granted literature
- US20200255595A1 POLYIMIDE RESIN PRECURSOR Public/Granted day:2020-08-13
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