Invention Grant
- Patent Title: Thermoplastic resin composition and molded article thereof
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Application No.: US16966713Application Date: 2019-02-01
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Publication No.: US11760840B2Publication Date: 2023-09-19
- Inventor: Ozora Baba
- Applicant: TEIJIN LIMITED
- Applicant Address: JP Osaka
- Assignee: TEIJIN LIMITED
- Current Assignee: TEIJIN LIMITED
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 18018358 2018.02.05
- International Application: PCT/JP2019/003730 2019.02.01
- International Announcement: WO2019/151504A 2019.08.08
- Date entered country: 2020-07-31
- Main IPC: C08K9/06
- IPC: C08K9/06 ; C08G77/448 ; B01J31/22

Abstract:
The present invention provides a resin composition which is excellent in moisture and heat resistance, thermal stability, rigidity, surface impact properties and chemical resistance. The resin composition includes, based on a total of 100 parts by weight consisting of (A) 30 to 99 parts by weight of a resin (component A), which is composed of 10 to 100 wt % of a polycarbonate-polydiorganosiloxane copolymer resin (component A1) and 0 to 90 wt % of an aromatic polycarbonate resin (component A2), and (B) 1 to 70 parts by weight of a polyester resin (component B), (C) 10 to 50 parts by weight of a filler (component C) which is surface-treated with a silane coupling agent having an alkyl group, wherein the content of rubber-like polymer is 3 parts by weight or less.
Public/Granted literature
- US20210032409A1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF Public/Granted day:2021-02-04
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