Invention Grant
- Patent Title: Prepreg resin composition, prepreg and molded article
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Application No.: US16649381Application Date: 2018-09-11
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Publication No.: US11760849B2Publication Date: 2023-09-19
- Inventor: Yuko Takikawa , Tomoaki Shinchi
- Applicant: DIC Corporation
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP 17186328 2017.09.27
- International Application: PCT/JP2018/033578 2018.09.11
- International Announcement: WO2019/065210A 2019.04.04
- Date entered country: 2020-05-07
- Main IPC: C08J5/04
- IPC: C08J5/04

Abstract:
Provided is a prepreg resin composition, containing: a urethane (meth)acrylate (A) that is a reaction product of polyisocyanate (a1), polyol (a2), and hydroxy alkyl (meth)acrylate (a3); a polymerization initiator (B); and a thermoplastic resin (C), as an essential component, in which the polyisocyanate (a1) is at least one polyisocyanate selected from 2,4′-diphenyl methane diisocyanate, 4,4′-diphenyl methane diisocyanate, a carbodiimide modified product of 4,4′-diphenyl methane diisocyanate, and polymethylene polyphenyl polyisocyanate. The prepreg resin composition of the invention is excellent in molding properties, and is capable of forming a molded article excellent in various physical properties such as flexibility, impact resistance, and heat resistance, and thus, can be preferably used in a prepreg and a molded article thereof.
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