• Patent Title: Prepreg resin composition, prepreg and molded article
  • Application No.: US16649381
    Application Date: 2018-09-11
  • Publication No.: US11760849B2
    Publication Date: 2023-09-19
  • Inventor: Yuko TakikawaTomoaki Shinchi
  • Applicant: DIC Corporation
  • Applicant Address: JP Tokyo
  • Assignee: DIC Corporation
  • Current Assignee: DIC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Locke Lord LLP
  • Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
  • Priority: JP 17186328 2017.09.27
  • International Application: PCT/JP2018/033578 2018.09.11
  • International Announcement: WO2019/065210A 2019.04.04
  • Date entered country: 2020-05-07
  • Main IPC: C08J5/04
  • IPC: C08J5/04
Prepreg resin composition, prepreg and molded article
Abstract:
Provided is a prepreg resin composition, containing: a urethane (meth)acrylate (A) that is a reaction product of polyisocyanate (a1), polyol (a2), and hydroxy alkyl (meth)acrylate (a3); a polymerization initiator (B); and a thermoplastic resin (C), as an essential component, in which the polyisocyanate (a1) is at least one polyisocyanate selected from 2,4′-diphenyl methane diisocyanate, 4,4′-diphenyl methane diisocyanate, a carbodiimide modified product of 4,4′-diphenyl methane diisocyanate, and polymethylene polyphenyl polyisocyanate. The prepreg resin composition of the invention is excellent in molding properties, and is capable of forming a molded article excellent in various physical properties such as flexibility, impact resistance, and heat resistance, and thus, can be preferably used in a prepreg and a molded article thereof.
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