Invention Grant
- Patent Title: Resin composition for encapsulation
-
Application No.: US16963292Application Date: 2019-01-23
-
Publication No.: US11760870B2Publication Date: 2023-09-19
- Inventor: Yosuke Oi , Takashi Hiraoka
- Applicant: NAGASE CHEMTEX CORPORATION
- Applicant Address: JP Osaka
- Assignee: NAGASE CHEMTEX CORPORATION
- Current Assignee: NAGASE CHEMTEX CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP 18008661 2018.01.23
- International Application: PCT/JP2019/002010 2019.01.23
- International Announcement: WO2019/146617A 2019.08.01
- Date entered country: 2020-07-20
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08G59/42 ; C08G59/50 ; C08G59/62 ; C08K3/36 ; C08K5/06 ; C08K7/18
Abstract:
An object of the present invention is to provide a resin composition for encapsulation capable of suppressing warpage even when a large-area substrate is encapsulated.
In order to solve the above problems, a resin composition for encapsulating an electronic member containing an epoxy resin (A), a compound having a polyalkylene glycol chain (B), and an inorganic filler (C) is provided.
Thus, even when a large-area substrate is encapsulated, an effect of suppressing the warpage can be obtained.
In order to solve the above problems, a resin composition for encapsulating an electronic member containing an epoxy resin (A), a compound having a polyalkylene glycol chain (B), and an inorganic filler (C) is provided.
Thus, even when a large-area substrate is encapsulated, an effect of suppressing the warpage can be obtained.
Public/Granted literature
- US20210054187A1 RESIN COMPOSITION FOR SEALING Public/Granted day:2021-02-25
Information query
