Invention Grant
- Patent Title: Adhesive tape
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Application No.: US18157223Application Date: 2023-01-20
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Publication No.: US11760904B2Publication Date: 2023-09-19
- Inventor: Mai Hasebe , Hideaki Takei , Yusuke Takahashi , Yukie Uemura , Kumiko Karasawa
- Applicant: DIC Corporation
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JP 22010801 2022.01.27
- Main IPC: C09J7/10
- IPC: C09J7/10 ; C09J175/08 ; C09J7/38

Abstract:
An adhesive tape including an adhesive layer is provided. The adhesive layer has a biobased content of 50% or more by mass. The adhesive layer contains a reaction product of a urethane resin (A) and a cross-linking agent (B). The urethane resin (A) contains at least a structural unit derived from a biobased polyether polyol and a structural unit derived from an aromatic polyisocyanate. The adhesive layer has a gel fraction of 10% or more by mass and 80% or less by mass and a stress of less than 50 N/cm2 at 100% strain in a stress-strain curve.
Public/Granted literature
- US20230235195A1 ADHESIVE TAPE Public/Granted day:2023-07-27
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