Invention Grant
- Patent Title: Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones
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Application No.: US16745400Application Date: 2020-01-17
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Publication No.: US11761107B2Publication Date: 2023-09-19
- Inventor: Weijing Lu , Lingli Duan , Zukhra Niazimbetova , Chen Chen , Maria Rzeznik
- Applicant: Dow Global Technologies LLC , Rohm and Haas Electronic Materials LLC
- Applicant Address: US MI Midland
- Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee Address: US MA Marlborough
- Agent John J. Piskorski
- The original application number of the division: US15752636
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D3/58 ; C25D7/12 ; C08G73/02
Abstract:
Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
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