Invention Grant
- Patent Title: Edge compute components under a memory array
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Application No.: US17946769Application Date: 2022-09-16
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Publication No.: US11762577B2Publication Date: 2023-09-19
- Inventor: Glen E. Hush , Richard C. Murphy , Honglin Sun
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G06F3/00

Abstract:
Apparatuses and methods can be related to implementing edge compute components in a memory array. Compute components can be implemented under a memory array. Implementing compute components under a memory array can limit control access to the compute components due to die space utilized by the compute components. A portion of the compute components (e.g., compute components on the edge) may have control access that is not available to the remainder of the compute components.
Public/Granted literature
- US20230020912A1 EDGE COMPUTE COMPONENTS UNDER A MEMORY ARRAY Public/Granted day:2023-01-19
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