Invention Grant
- Patent Title: Method of forming structure having coating layer and structure having coating layer
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Application No.: US17327786Application Date: 2021-05-24
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Publication No.: US11764057B2Publication Date: 2023-09-19
- Inventor: Chuan-Pu Liu , Yin-Wei Cheng , Shih-An Wang , Bo-Liang Peng , Chun-Hung Chen , Jun-Han Huang , Yi-Chang Li
- Applicant: CHE Inc.
- Applicant Address: TW Kaohsiung
- Assignee: CHE Inc.
- Current Assignee: CHE Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: LAW OFFICE OF MICHAEL CHEN
- Agent Che Yang Chen
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A method of forming a structure having a coating layer includes the following steps: providing a substrate; coating a fluid on the surface of the substrate, where the fluid includes a carrier and a plurality of silicon-containing nanoparticles; and performing a heating process to remove the carrier and convert the silicon-containing nanoparticles into a silicon-containing layer, a silicide layer, or a stack layer including the silicide layer and the silicon-containing layer.
Public/Granted literature
- US20220375748A1 METHOD OF FORMING STRUCTURE HAVING COATING LAYER AND STRUCTURE HAVING COATING LAYER Public/Granted day:2022-11-24
Information query
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