Invention Grant
- Patent Title: Wafer cleaning apparatus and method
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Application No.: US17350036Application Date: 2021-06-17
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Publication No.: US11764081B2Publication Date: 2023-09-19
- Inventor: Jieh-Chau Huang , Bi-Ming Yen , Hung-Lung Hu , Ying Ting Hsia , Ping-Jung Huang , Pei Yen Hsia
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- The original application number of the division: US16100635 2018.08.10
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/673 ; H01L21/687

Abstract:
The present disclosure relates to an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.
Public/Granted literature
- US20210313200A1 WAFER CLEANING APPARATUS AND METHOD Public/Granted day:2021-10-07
Information query
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