Invention Grant
- Patent Title: Semiconductor wafer storage device
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Application No.: US17228337Application Date: 2021-04-12
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Publication No.: US11764089B2Publication Date: 2023-09-19
- Inventor: Yu Ju- Chen , Ren-Hao Jheng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler Goldstein & Fox P.L.L.C.
- The original application number of the division: US16456118 2019.06.28
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/683 ; H01L21/687

Abstract:
The present disclosure describes a method for substrate storage. The method can include respectively placing a plurality of substrates into a plurality of slots formed by a plurality of fin structures on a panel of a storage device. The method can further include binding each of the plurality of substrates to an corresponding one of the plurality of fin structures. The method can further include moving the storage device from a first location to a second location. The method can further include un-binding the plurality of substrates from the plurality of fin structures.
Public/Granted literature
- US20210257229A1 SEMICONDUCTOR WAFER STORAGE DEVICE Public/Granted day:2021-08-19
Information query
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