Invention Grant
- Patent Title: Automatic wafer centering method and apparatus
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Application No.: US17398847Application Date: 2021-08-10
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Publication No.: US11764093B2Publication Date: 2023-09-19
- Inventor: Alexander Krupyshev , Leigh F. Sharrock
- Applicant: Brooks Automation, Inc.
- Applicant Address: US MA Chelmsford
- Assignee: Brooks Automation US, LLC
- Current Assignee: Brooks Automation US, LLC
- Current Assignee Address: US MA Chelmsford
- Agency: Perman & Green, LLP
- Main IPC: H01L21/68
- IPC: H01L21/68 ; B25J9/16 ; B25J11/00 ; B65G47/90 ; H01L21/67 ; H01L21/677 ; H01L21/687

Abstract:
A substrate transport apparatus including a transport chamber, a drive section, a robot arm having an end effector at a distal end configured to support a substrate and being connected to the drive section generating at least arm motion in a radial direction extending and retracting the arm, an imaging system with a camera mounted in a predetermined location to image at least part of the robot arm, and a controller connected to the imaging system to image the arm moving to a predetermined repeatable position, the controller effecting capture of a first image of the robot arm proximate to the repeatable position decoupled from encoder data of the drive axis, wherein the controller calculates a positional variance of the robot arm from comparison of the first image with a calibration image, and from the positional variance determines a motion compensation factor changing the extended position of the robot arm.
Public/Granted literature
- US20210375657A1 AUTOMATIC WAFER CENTERING METHOD AND APPARATUS Public/Granted day:2021-12-02
Information query
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