Invention Grant
- Patent Title: Connection of several circuits of an electronic chip
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Application No.: US17580055Application Date: 2022-01-20
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Publication No.: US11764151B2Publication Date: 2023-09-19
- Inventor: Samuel Boscher , Yann Rebours , Michel Cuenca
- Applicant: STMicroelectronics (Rousset) SAS , STMicroelectronics (Grenoble 2) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS,STMicroelectronics (Grenoble 2) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS,STMicroelectronics (Grenoble 2) SAS
- Current Assignee Address: FR Rousset; FR Grenoble
- Agency: CROWE & DUNLEVY
- Priority: FR 06583 2019.06.19
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/50 ; H01L23/522
Abstract:
An electronic chip includes a shared strip with first and second spaced apart portions extending along a direction of elongation and an intermediate connecting portion extending between the first and second portions. The second portion is connected to a pad that has a greater surface area than the second portion. The first portion is formed by a first plurality of metallic strips. Metallic strips of the first plurality of metallic strips that are adjacent and side by side are separated by a distance smaller than a width of those metallic strips. The second portion is formed by a second plurality of metallic strips. Metallic strips of the second plurality of metallic strips that are adjacent and side by side are separated by a distance smaller than a width of those metallic strips.
Public/Granted literature
- US20220148962A1 CONNECTION OF SEVERAL CIRCUITS OF AN ELECTRONIC CHIP Public/Granted day:2022-05-12
Information query
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