Invention Grant
- Patent Title: Pixel array substrate
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Application No.: US17359649Application Date: 2021-06-28
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Publication No.: US11764229B2Publication Date: 2023-09-19
- Inventor: Hsiu-Chun Hsieh , Hsin-Hung Sung , Shu-Hui Huang , Chih-Chung Su , Yi-Wei Chen , Fang-Hui Chan
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW 9140819 2020.11.20
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L25/16

Abstract:
A pixel array substrate, including a substrate, multiple conductors, a pixel driving circuit, a first pad, and a second pad, is provided. The substrate has a first surface, a second surface, and multiple through holes. The through holes extend from the first surface to the second surface. The conductors are respectively disposed in the through holes. The pixel driving circuit is disposed on the first surface of the substrate. The first pad and the second pad are disposed on the second surface of the substrate. The conductors include a first conductor, a second conductor, and a first dummy conductor. The first conductor is electrically connected to the pixel driving circuit and the first pad. The second conductor is electrically connected to the pixel driving circuit and the second pad. The first dummy conductor is overlapped with and electrically isolated from the pixel driving circuit.
Public/Granted literature
- US20220165755A1 PIXEL ARRAY SUBSTRATE Public/Granted day:2022-05-26
Information query
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