Invention Grant
- Patent Title: LDD-free semiconductor structure and manufacturing method of the same
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Application No.: US17364426Application Date: 2021-06-30
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Publication No.: US11764264B2Publication Date: 2023-09-19
- Inventor: Chun Hsiung Tsai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- The original application number of the division: US14632465 2015.02.26
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/36 ; H01L29/78 ; H01L29/66 ; H01L27/092 ; H01L21/8238 ; H01L29/165 ; H01L29/06

Abstract:
The present disclosure provides an LDD-free semiconductor structure including a semiconductor layer, a gate over the semiconductor layer and a regrowth region made of semiconductor material positioned in the semiconductor layer. The regrowth region forms a source region or a drain region of the LDD-free semiconductor structure. The gate includes a gate electrode layer laterally covered by a gate spacer. The regrowth region extends towards a region beneath the gate spacer and close to a plane extending along a junction of the gate spacer and the gate electrode layer. The present disclosure also provides a method for manufacturing an LDD-free semiconductor structure. The method includes forming a gate over a semiconductor layer, removing a portion of the semiconductor layer and obtaining a recess, and forming a regrowth region over the recess.
Public/Granted literature
- US20210328016A1 LDD-FREE SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2021-10-21
Information query
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