Invention Grant
- Patent Title: Very high speed, high density electrical interconnection system with impedance control in mating region
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Application No.: US17107761Application Date: 2020-11-30
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Publication No.: US11764523B2Publication Date: 2023-09-19
- Inventor: Mark W. Gailus , John Robert Dunham , Marc B. Cartier, Jr. , Donald A. Girard, Jr.
- Applicant: Amphenol Corporation
- Applicant Address: US CT Wallingford
- Assignee: Amphenol Corporation
- Current Assignee: Amphenol Corporation
- Current Assignee Address: US CT Wallingford
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01R13/6586
- IPC: H01R13/6586 ; H01R12/58 ; H01R13/6474 ; H01R12/70 ; H01R13/6461 ; H01R13/6473 ; H01R13/6585

Abstract:
A modular electrical connector with separately shielded signal conductor pairs. In some embodiments, the connector is may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. In some embodiments, the modules may have projecting portions, of conductive and/or dielectric material, that are shaped and positioned to reduce changes in impedance along the signal paths as a function of separation of conductive elements, when the connectors are separated by less than the functional mating range.
Public/Granted literature
- US20210083434A1 VERY HIGH SPEED, HIGH DENSITY ELECTRICAL INTERCONNECTION SYSTEM WITH IMPEDANCE CONTROL IN MATING REGION Public/Granted day:2021-03-18
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