Invention Grant
- Patent Title: Bus splice
-
Application No.: US17390563Application Date: 2021-07-30
-
Publication No.: US11764560B2Publication Date: 2023-09-19
- Inventor: Daniel M. O'Neill
- Applicant: Schneider Electric USA, Inc.
- Applicant Address: US MA Andover
- Assignee: Schneider Electric USA, Inc.
- Current Assignee: Schneider Electric USA, Inc.
- Current Assignee Address: US MA Boston
- Agency: Locke Lord LLP
- Main IPC: H02G5/00
- IPC: H02G5/00 ; H01H1/36 ; H01H1/50

Abstract:
A busway system including a first electrical busway section, a second electrical busway section, the first and the second electrical busway sections being offset from each other, a busway joint for coupling the first and the second electrical busway sections. The busway joint including a plurality of busbars, a plurality of splice plates electrically coupled to the plurality of busbars, the plurality of splice plates and the plurality of busbars configured to electrically couple the first and the second electrical busway sections, and a pivot shaft passing through the plurality of busbars and splice plates.
Public/Granted literature
- US20230034457A1 BUS SPLICE AND METHOD OF USE Public/Granted day:2023-02-02
Information query