Invention Grant
- Patent Title: Substrate processing apparatus and monitoring method
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Application No.: US16868843Application Date: 2020-05-07
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Publication No.: US11765879B2Publication Date: 2023-09-19
- Inventor: Junnosuke Taguchi
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP 19092353 2019.05.15
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H10B12/00 ; H01L27/02 ; H01L21/68 ; H10B20/00
Abstract:
A substrate processing apparatus according to an aspect of the present disclosure includes a mounting section on which a substrate is placed, a structure member provided above the mounting section so as to face the mounting section, and an optical sensor. The optical sensor is configured to detect a height of the mounting section, a height of the structure member, and a height of the substrate, by emitting light from above the structure member to a predetermined location of the mounting section, a predetermined location of the structure member, and the substrate, and by receiving reflection light from the mounting section, the structure member, and the substrate.
Information query
IPC分类:
