Invention Grant
- Patent Title: Semiconductor devices including a buried gate electrode
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Application No.: US17210931Application Date: 2021-03-24
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Publication No.: US11765885B2Publication Date: 2023-09-19
- Inventor: Hyewon Kim , Juhyung We , Sungmi Yoon , Donghyun Im , Sangwoon Lee , Taiuk Rim , Kyosuk Chae
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR 20200094372 2020.07.29
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L21/28 ; H01L29/423 ; H01L29/10 ; H01L29/78

Abstract:
A semiconductor device including a substrate including a recess; a gate insulation layer on a surface of the recess; a first gate pattern on the gate insulation layer and filling a lower portion of the recess; a second gate pattern on the first gate pattern in the recess and including a material having a work function different from a work function of the first gate pattern; a capping insulation pattern on the second gate pattern and filling an upper portion of the recess; a leakage blocking oxide layer on the gate insulation layer at an upper sidewall of the recess above an upper surface of the first gate pattern and contacting a sidewall of the capping insulation pattern; and impurity regions in the substrate and adjacent to the upper sidewall of the recess, each impurity region having a lower surface higher than the upper surface of the first gate pattern.
Public/Granted literature
- US20220037328A1 SEMICONDUCTOR DEVICES Public/Granted day:2022-02-03
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