Invention Grant
- Patent Title: Foot device
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Application No.: US17319176Application Date: 2021-05-13
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Publication No.: US11766094B2Publication Date: 2023-09-26
- Inventor: Michael D. Weiss
- Applicant: WASHINGTON UNIVERSITY
- Applicant Address: US MO St. Louis
- Assignee: Washington University
- Current Assignee: Washington University
- Current Assignee Address: US MO St. Louis
- Agency: Armstrong Teasdale LLP
- Main IPC: A43B3/00
- IPC: A43B3/00 ; A43B7/14 ; A43B17/02 ; A43B17/14 ; A43B7/1425 ; A43B7/1435

Abstract:
Methods of using a foot device are disclosed herein. The foot device includes a generally U-shaped portion having an arcuate portion and first and second legs extending from the arcuate portion. Each leg has an end and a relief area disposed adjacent the respective end. A method of using the foot device comprises engaging the arcuate portion with a heel of a foot to form a first point of contact; positioning the relief area of the first leg proximate a fifth metatarsal head of the foot such that the fifth metatarsal head drops to form a second point of contact; and positioning the relief area of the second leg proximate a first metatarsal head of the foot such that the first metatarsal head drops to form a third point of contact, wherein the first, second, and third points of contact form a triangle-shaped contact surface.
Public/Granted literature
- US20210267311A1 FOOT DEVICE Public/Granted day:2021-09-02
Information query
IPC分类:
A | 人类生活必需 |
A43 | 鞋类 |
A43B | 鞋类的特征;鞋类的部件 |
A43B3/00 | 以形状或用途作为特征的鞋 |