Invention Grant
- Patent Title: Prosthetic heart valve cooling
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Application No.: US17747292Application Date: 2022-05-18
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Publication No.: US11766325B2Publication Date: 2023-09-26
- Inventor: Wei Wang , Benjamin Wong , Laura McKinley , Joshua Dudney , Tracey Tien , Karl Olney
- Applicant: Medtronic Vascular, Inc.
- Applicant Address: US CA Santa Rosa
- Assignee: MEDTRONIC VASCULAR, INC.
- Current Assignee: MEDTRONIC VASCULAR, INC.
- Current Assignee Address: US CA Santa Rosa
- Agency: Wentsler LLC
- Main IPC: A61F2/24
- IPC: A61F2/24 ; A61F2/95 ; B65B63/02 ; B65B63/08

Abstract:
Devices for, and methods of, compressing a stented prosthetic heart valve are disclosed. The method including inserting a stented prosthetic heart valve having a self-expandable stent frame into a container, initiating a cooling element in the container, transferring heat through a thermal conductor to cool an interior of the container, reducing a temperature of the self-expandable stent frame while located within the container to a critical temperature of not greater than 8° C., and compressing an outer diameter of the stented prosthetic heart valve while the stented prosthetic heart valve is at the critical temperature.
Public/Granted literature
- US20220273425A1 PROSTHETIC HEART VALVE COOLING Public/Granted day:2022-09-01
Information query
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