Invention Grant
- Patent Title: Laser processing apparatus
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Application No.: US17540061Application Date: 2021-12-01
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Publication No.: US11766742B2Publication Date: 2023-09-26
- Inventor: Kenichi Kakishita
- Applicant: Prime Planet Energy & Solutions, Inc.
- Applicant Address: JP Tokyo
- Assignee: PRIME PLANET ENERGY & SOLUTIONS, INC.
- Current Assignee: PRIME PLANET ENERGY & SOLUTIONS, INC.
- Current Assignee Address: JP Tokyo
- Agency: HAUPTMAN HAM, LLP
- Main IPC: B23K26/16
- IPC: B23K26/16 ; B23K37/04 ; B23K26/08

Abstract:
A laser processing apparatus includes a feeding mechanism including at least one feeding roller and winds the electrode sheet around an outer circumferential surface of the feeding roller to feed the electrode sheet in a feeding direction. When an imaginary contact plane surface contacted with a first surface of the electrode sheet on the laser processing points generated on the electrode sheet by a laser irradiation mechanism is determined as a boundary, a region on a side where the electrode sheet is contacted with the imaginary contact plane surface is defined as a first region and a region on an opposite side is defined as a second region. A peripheral edge of an opening portion of the dust collection hood is placed in the first region with respect to the imaginary contact plane surface.
Public/Granted literature
- US20220168843A1 LASER PROCESSING APPARATUS Public/Granted day:2022-06-02
Information query
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