Invention Grant
- Patent Title: Laser machine
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Application No.: US16603365Application Date: 2018-04-18
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Publication No.: US11766751B2Publication Date: 2023-09-26
- Inventor: Youichirou Shimizu , Takayuki Saisu
- Applicant: KOMATSU INDUSTRIES CORPORATION
- Applicant Address: JP Kanazawa
- Assignee: KOMATSU INDUSTRIES CORPORATION
- Current Assignee: KOMATSU INDUSTRIES CORPORATION
- Current Assignee Address: JP Kanazawa
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JP 17127365 2017.06.29
- International Application: PCT/JP2018/015949 2018.04.18
- International Announcement: WO2019/003596A 2019.01.03
- Date entered country: 2019-10-07
- Main IPC: B23Q1/44
- IPC: B23Q1/44 ; B23K26/70 ; B23K26/12 ; B23K37/04 ; B65G47/80 ; B23K26/36

Abstract:
Provided is a laser machine which achieves an enhanced durability against laser beam irradiation. A workpiece transfer device for carrying a workpiece into and out of a workpiece machining chamber, has a turntable device and a partition wall. The partition wall is secured to the top surface of the turntable device, partitioning the top surface of the turntable device into a plurality of workpiece mounting tables on which workpieces can be mounted. The partition wall has: a first plate forming one surface of the partition wall and formed of aluminum alloy; a second plate forming the other surface of the partition wall and formed of aluminum alloy; and a frame for securing the first plate and the second plate in a spaced apart relationship.
Public/Granted literature
- US20210086318A1 LASER MACHINE Public/Granted day:2021-03-25
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