Invention Grant
- Patent Title: Substrate treatment apparatus
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Application No.: US16693569Application Date: 2019-11-25
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Publication No.: US11766765B2Publication Date: 2023-09-26
- Inventor: Ki Sang Eum , Byoung Ok Kim , Jae Hun Jeong , Ju Eun Kim , Jun Ho Seo , Man Kyu Kang
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: Semes Co., Ltd.
- Current Assignee: Semes Co., Ltd.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: RatnerPrestia
- Priority: KR 20180152105 2018.11.30
- Main IPC: B25B11/00
- IPC: B25B11/00 ; H01L21/68 ; H01L21/687 ; H01L21/683
Abstract:
A substrate treatment apparatus is provided. The substrate treatment apparatus includes a substrate support part provided with a seating surface and configured to support a substrate, a guide ring annularly disposed along an edge of the substrate support part to surround the substrate, and a centering part provided inside the guide ring and configured to center the substrate by moving in a direction parallel to the seating surface to pressurize the edge of the substrate.
Public/Granted literature
- US20200171626A1 SUBSTRATE TREATMENT APPARATUS Public/Granted day:2020-06-04
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