Invention Grant
- Patent Title: Die cutter holding and lifting apparatus
-
Application No.: US16220237Application Date: 2018-12-14
-
Publication No.: US11766802B2Publication Date: 2023-09-26
- Inventor: Timothy W. Sheriff
- Applicant: Swanstrom Tools USA Inc.
- Applicant Address: US WI Superior
- Assignee: SWANSTROM TOOLS USA INC.
- Current Assignee: SWANSTROM TOOLS USA INC.
- Current Assignee Address: US WI Superior
- Agency: Faegre Drinker Biddle & Reath LLP
- Main IPC: B26F1/14
- IPC: B26F1/14 ; B26F1/40 ; B26F1/38 ; B26F1/44 ; B21D28/14

Abstract:
Die cutter holding and lifting systems, apparatuses, and methods for use with custom and commercially available die cutters. According to some examples, a system includes a base, a separation assembly, and an actuation assembly. A separation assembly can be coupled to the die cutter, and the die cutter in combination with the separation assembly can be coupled to the base, such that the actuation assembly can be utilized to cause a separation of die plates of the die cutter for increased productivity in cutting, stamping, or pressing operations involving die cutters.
Public/Granted literature
- US20190184594A1 DIE CUTTER HOLDING AND LIFTING APPARATUS Public/Granted day:2019-06-20
Information query
IPC分类: