Invention Grant
- Patent Title: Injection molded component and method of injection molding
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Application No.: US17677474Application Date: 2022-02-22
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Publication No.: US11766815B2Publication Date: 2023-09-26
- Inventor: Brian Robert Guerry , Matthew Richard Rutigliano , Sydney Marie Ogawa-Garcia
- Applicant: Rehrig Pacific Company
- Applicant Address: US CA Los Angeles
- Assignee: Rehrig Pacific Company
- Current Assignee: Rehrig Pacific Company
- Current Assignee Address: US CA Los Angeles
- Agency: Carlson, Gaskey & Olds, P.C.
- The original application number of the division: US15899085 2018.02.19
- Main IPC: B29C45/14
- IPC: B29C45/14 ; B29C45/00 ; B29C45/73 ; B65D19/00 ; B29L31/00
Abstract:
An injection molded component includes a wall that has an inner wall surface and an outer wall surface. A sensor is molded into one of the inner wall surface and the outer wall surface. A channel is at least partially surrounding the sensor.
Public/Granted literature
- US20220234264A1 INJECTION MOLDED COMPONENT AND METHOD OF INJECTION MOLDING Public/Granted day:2022-07-28
Information query
