Invention Grant
- Patent Title: Joining material and silicon carbide based honeycomb structure
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Application No.: US16803092Application Date: 2020-02-27
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Publication No.: US11767270B2Publication Date: 2023-09-26
- Inventor: Keisuke Kimura
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK INSULATORS, LTD.
- Current Assignee: NGK INSULATORS, LTD.
- Current Assignee Address: JP Nagoya
- Agency: BURR PATENT LAW, PLLC
- Priority: JP 19061681 2019.03.27
- Main IPC: B01D46/24
- IPC: B01D46/24 ; C04B38/00 ; C04B35/565 ; B01D39/20 ; C04B26/28

Abstract:
A joining material used for joining side surfaces of a plurality of silicon carbide-based honeycomb segments to each other to produce a silicon carbide-based honeycomb structure. The joining material contains from 0.1 to 50% by mass of processed powder generated in the production of the silicon carbide-based honeycomb segments and/or the silicon carbide-based honeycomb structure. The joining material has an average particle diameter D50 of from 0.5 to 60 μm.
Public/Granted literature
- US20200308069A1 JOINING MATERIAL AND SILICON CARBIDE BASED HONEYCOMB STRUCTURE Public/Granted day:2020-10-01
Information query
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