Invention Grant
- Patent Title: Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
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Application No.: US17784163Application Date: 2020-12-09
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Publication No.: US11767287B2Publication Date: 2023-09-26
- Inventor: Shunsuke Katagiri , Takuya Suzuki , Seiji Shika , Yune Kumazawa
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Priority: JP 19223931 2019.12.11
- International Application: PCT/JP2020/045830 2020.12.09
- International Announcement: WO2021/117760A 2021.06.17
- Date entered country: 2022-06-10
- Main IPC: C07C69/75
- IPC: C07C69/75 ; C08G73/12 ; H05K1/02
Abstract:
A compound (A) of the present invention is represented by the formula (1): wherein each R1 independently represents a group represented by the formula (2) or a hydrogen atom, and each R2 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R1 is a group represented by the formula (2); and wherein -* represents a bonding hand.
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