Invention Grant
- Patent Title: Compound, pattern forming substrate, coupling agent, and pattern formation method
-
Application No.: US16744949Application Date: 2020-01-16
-
Publication No.: US11767327B2Publication Date: 2023-09-26
- Inventor: Yusuke Kawakami , Kazuo Yamaguchi
- Applicant: NIKON CORPORATION , Kanagawa University
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION,KANAGAWA UNIVERSITY
- Current Assignee: NIKON CORPORATION,KANAGAWA UNIVERSITY
- Current Assignee Address: JP Tokyo; JP Yokohama
- Priority: JP 17140046 2017.07.19
- Main IPC: C07D495/04
- IPC: C07D495/04 ; C07D409/12 ; C07F7/08 ; G03F7/075 ; H10K71/00 ; H10K85/40 ; H10K85/60
Abstract:
What is provided is a compound, a pattern forming substrate, a coupling agent, and a pattern formation method. The compound is represented by Formula (1).
[in the formula, X01 represents a group exhibiting semiconductor characteristics and Y represents a divalent linking group]
[in the formula, X01 represents a group exhibiting semiconductor characteristics and Y represents a divalent linking group]
Public/Granted literature
- US20200148700A1 COMPOUND, PATTERN FORMING SUBSTRATE, COUPLING AGENT, AND PATTERN FORMATION METHOD Public/Granted day:2020-05-14
Information query
