Invention Grant
- Patent Title: Organometallic cluster photoresists for EUV lithography
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Application No.: US17870324Application Date: 2022-07-21
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Publication No.: US11767336B2Publication Date: 2023-09-26
- Inventor: Hsu-Kai Chang , Chi-Ming Yang , Jui-Hsiung Liu , Jui-Hung Fu , Hsin-Yi Wu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: SEED IP LAW GROUP LLP
- The original application number of the division: US16583182 2019.09.25
- Main IPC: C07F7/22
- IPC: C07F7/22 ; G03F7/004 ; G03F7/36 ; G03F7/20 ; G03F7/32 ; G03F7/30
Abstract:
The present disclosure is directed to organotin cluster compounds having formula (I) and their use as photoresists in extreme ultraviolet lithography processes.
Public/Granted literature
- US20220380392A1 ORGANOMETALLIC CLUSTER PHOTORESISTS FOR EUV LITHOGRAPHY Public/Granted day:2022-12-01
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