Invention Grant
- Patent Title: Polishing liquid, polishing liquid set, and polishing method
-
Application No.: US16981589Application Date: 2019-03-20
-
Publication No.: US11767448B2Publication Date: 2023-09-26
- Inventor: Takaaki Matsumoto , Tomohiro Iwano , Tomoyasu Hasegawa , Tomomi Kukita
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: RESONAC CORPORATION
- Current Assignee: RESONAC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, L.L.P.
- Priority: WO TJP2018011464 2018.03.22 WO TJP2018028105 2018.07.26 WO TJP2018035480 2018.09.25
- International Application: PCT/JP2019/011867 2019.03.20
- International Announcement: WO2019/182061A 2019.09.26
- Date entered country: 2020-09-16
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/304 ; H01L21/3105 ; B24B37/04 ; C09K13/06 ; B24B1/00 ; C09G1/06 ; H01L21/306 ; C09K3/14 ; C09G1/04 ; C09G1/00 ; H01L21/321
Abstract:
A polishing liquid containing: abrasive grains; a hydroxy acid; a polymer compound having at least one selected from the group consisting of a hydroxyl group and an amide group; and a liquid medium, in which a zeta potential of the abrasive grains is positive, and a weight average molecular weight of the polymer compound is 3000 or more.
Public/Granted literature
- US20210054233A1 POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD Public/Granted day:2021-02-25
Information query
