- Patent Title: Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
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Application No.: US17529769Application Date: 2021-11-18
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Publication No.: US11767606B2Publication Date: 2023-09-26
- Inventor: Junitsu Yamakawa , Chunhui Dou , Risa Kimura , Toshio Yokoyama
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: BakerHostetler
- Priority: JP 18155392 2018.08.22
- The original application number of the division: US17268036
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D7/12 ; B22F1/00 ; C25D17/00 ; C25D21/14
Abstract:
The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.
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