Invention Grant
- Patent Title: Flow sensing device
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Application No.: US17648360Application Date: 2022-01-19
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Publication No.: US11768093B2Publication Date: 2023-09-26
- Inventor: Scott Edward Beck , Yong-Fa Wang , Philip C. Foster
- Applicant: Honeywell International Inc.
- Applicant Address: US NC Charlotte
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NC Charlotte
- Agency: Alston & Bird LLP
- Main IPC: G01F1/692
- IPC: G01F1/692 ; G01F1/684 ; G01F1/688 ; G01F1/69

Abstract:
Methods and apparatuses associated with an example flow sensing device are provided. In some examples, the flow sensing device may include a flow cap component and a sensor component. In some examples, the flow cap component may include a heating element disposed in a first layer of the flow cap component. In some examples, the sensor component may include at least one thermal sensing element disposed in a second layer of the sensor component. In some examples, the first layer and the second layer are noncoplanar. In some examples, the flow cap component may be bonded to a first surface of the sensor component to form a flow channel. In some examples, the first layer and the second layer may be noncoplanar and separated by the flow channel.
Public/Granted literature
- US20220136882A1 FLOW SENSING DEVICE Public/Granted day:2022-05-05
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