Invention Grant
- Patent Title: Optical sensor assembly
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Application No.: US17426088Application Date: 2020-01-23
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Publication No.: US11768104B2Publication Date: 2023-09-26
- Inventor: Byung Il Min
- Applicant: ARCSOFT CORPORATION LIMITED
- Applicant Address: CN Zhejiang
- Assignee: ARCSOFT CORPORATION LIMITED
- Current Assignee: ARCSOFT CORPORATION LIMITED
- Current Assignee Address: CN Zhejiang
- Agent Gang Yu
- Priority: KR 20190010548 2019.01.28
- International Application: PCT/CN2020/074012 2020.01.23
- International Announcement: WO2020/156486A 2020.08.06
- Date entered country: 2021-07-27
- Main IPC: G01J1/42
- IPC: G01J1/42 ; G01J1/04 ; G02B6/42 ; G02B6/43

Abstract:
The present disclosure relates to an optical sensor assembly. According to one aspect of the present disclosure, an embodiment of the optical sensor assembly is provided. The optical sensor assembly includes a plurality of optical fibers, wherein one ends of the plurality of optical fibers are configured in a row, and the other ends of the plurality of optical fibers are stacked in at least two rows, such that a width of a first surface formed by the one ends of the plurality of optical fibers is greater than a width of a second surface formed by the other ends of the plurality of optical fibers, and the optical sensor assembly further includes a sensor connector optically coupled with the second surface. And the sensor connector can be separated from the first surface and configured inside the electronic device.
Public/Granted literature
- US20220090960A1 Optical Sensor Assembly Public/Granted day:2022-03-24
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