Invention Grant
- Patent Title: Techniques for compact LIDAR system
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Application No.: US17849219Application Date: 2022-06-24
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Publication No.: US11768279B2Publication Date: 2023-09-26
- Inventor: Zhizhong Tang , Pradeep Srinivasan , Bing Shen
- Applicant: AEVA, INC.
- Applicant Address: US CA Mountain View
- Assignee: Aeva, Inc.
- Current Assignee: Aeva, Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: G01S7/481
- IPC: G01S7/481 ; H01L25/16 ; G01S7/4863 ; G01S17/32 ; G01S17/89 ; H01L21/60

Abstract:
A light detection and ranging (LIDAR) system and apparatus including a photonics chip mounted to a substrate, the photonics chip including one or more optical components and one or more electrical components and one or more integrated circuit (IC) chips mounted to the photonics chip to process an electrical signal generated by the one or more optical components and the one or more electrical components, wherein the one or more IC chips are physically separated from the substrate to reduce crosstalk on the LIDAR apparatus.
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