Invention Grant
- Patent Title: Package for optical module
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Application No.: US17639822Application Date: 2019-09-18
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Publication No.: US11768341B2Publication Date: 2023-09-26
- Inventor: Shigeru Kanazawa , Takahiko Shindo , Meishin Chin
- Applicant: Nippon Telegraph and Telephone Corporation
- Applicant Address: JP Tokyo
- Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
- Current Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- International Application: PCT/JP2019/036620 2019.09.18
- International Announcement: WO2021/053764A 2021.03.25
- Date entered country: 2022-03-02
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H04B10/00

Abstract:
There is provided a highly convenient package for an optical module in which a device can be mounted as it is even when the number and mounting position thereof are different according to the device to be mounted. The package includes a base plate having a top surface on which devices are assembled, an optical fiber mounting component mounted on the top surface of the base plate, a direct current electrical interface component and a high frequency electrical interface component mounted on the top surface of the base plate. The optical fiber mounting component and the electrical interface components are separately manufactured, separately assembled on the top surface of the base plate, and fixed in different modes. The optical fiber mounting component is fixed by fastening with screws and fixed by soldering, and the electrical interface components are fixed by fastening with the screw.
Public/Granted literature
- US20220326455A1 Package for Optical Module Public/Granted day:2022-10-13
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